Welcome to Chip in Sampa 2019

São Paulo, SP, Brazil
August 26 to 30, 2019

 

The “Chip-in-Sampa 2019” is the most important microelectronics
international event that takes place in Brazil. This event is held on August 26 to
30, 2019 in São Paulo, the Brazilian economic center, and its organization is led
this year by the Laboratory of Integrated Systems (LSI), LSITEC and
Polytechnic School of University of São Paulo (USP).

The Chip-in-Sampa 2019 is composed by eight events:

In addition, there are the commemorative session of “50 years of
Microelectronics in Brazil”, Panel on “Women in Microelectronics”, Industrial
Panel and many technical and administrative meetings. During the Opening and
Closing sessions different Awards will be presented.
All activities are focused on academic and industrial professionals,
graduated and undergraduate students, allowing a fruitful meeting of the
microelectronics community and contributing to the emergence of the next
generation of Brazilian microelectronics researchers and professionals.
The different events organized within Chip-in-Sampa 2019 are sponsored
by Brazilian Microelectronic Society (SBMicro) and Brazilian Computer Society
(SBC) and co-sponsored by many international societies, such as: IEEE
Electron Device Society (EDS), IEEE Circuits and Systems (CAS), IEEE
Council on Electronic Design Automation (CEDA), IEEE Instrumentation &
Measurement, Association for Computing Machinery (ACM), ACM-special
interest group on design automation (SIGDA) and International Federation for
Information Processing (ifip). A special thanks to the Brazilian sponsoring
agencies CAPES, CNPq and FAPESP.

 
Many people from Brazilian and overseas universities helped to build the
Chip-in-Sampa 2019 program. This program includes 8 tutorials, 3 keynotes, 10
invited talks and 203 approved papers (125 for oral presentations and 78 for
poster presentations).
The event also includes an exhibition fair with 13 expositors and many
industrial sponsors: ABISEMI, KEYSIGHT, NXP, SYNOPSYS, ELDORADO,
SMART, ANACOM, BRASIL COMPONENTES, CADENCE, CEITEC, IMEC, MBRAUN, STMicroelectronics, TSA, EV-GROUP, IDEA, SIGNUM,
TEKTRONICS/FLUKE and WG3.

 
We would like to thank all the support from academic societies, from
companies and from Brazilian agencies. We also would like to thank the
Executive Committee, the Local Arrangements Committee, the reviewers and
the authors of the manuscripts. Together, this was an enormous human effort
that enabled the success of this conference.

 
Thank you very much!
We hope the microelectronics community enjoys Chip-in-Sampa 2019
and all activities that are carefully prepared for the audience.

Welcome to São Paulo
João Antonio Martino
Chip-in-Sampa 2019
General Chair


Keynote Speakers

CorClaysProf. Dr. Cor Claeys
Fellow IEEE, Fellow ECS
KU Leuven, Leuven, Belgium

Abstract: Advanced CMOS Integration Technologies for Future Mobile Applications

Short Bio


sachimnProf. Dr. Sachin Sapatnekar
University of Minnesota, USA

Abstract: Spintronics: From Devices to Circuits to Systems


Short Bio


JarProf. Dr. Jan M. Rabaey
University of California in Berkley, USA

Abstract: Human-Centric Computing

Short Bio


sbmicro-sponsors