SBCCI strongly encourages international submissions. Prospective authors from around the world are invited to submit manuscripts in English for consideration by the Program Committee. Manuscripts must contain a maximum of 10 pages, using 11-point font or larger and 1.5 or double spacing and prepared for blind review. Submissions of manuscripts previously published by other conferences or journals will not be considered by the program committee. SBCCI submissions must be made electronically (in PDF format) via the conference website. For proposals on special sessions, tutorials, panels and tool demos, please email a short description to the program chairs directly in advance of the submission deadline. For additional inquiries on submissions, please contact the program chairs. Final versions will be published as two-column, 6-page papers, following the ACM Press guidelines. The proceedings will be published by ACM Press and available in the Digital Library. The best papers presented at the symposium will be invited to resubmit an extended version to be considered for publication at the IEEE Design & Test and at the JICS - Journal of Integrated Circuits and Systems. Authors should include the complete address, phone/fax numbers and email address, and designate a contact person and a presenter.

Important Dates

Submission Deadline: March 24th, 2008
Extended Submission Deadline: March 31st, 2008
Notification of Acceptance (Extended): May 21st, 2008
Camera-Ready Deadline (Extended): June 18th, 2008

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