Impact of the Nitrogen Concentration of Sub-1.3 nm Gate Oxides on 65 nm Technology Transistor Parameters
A. L. P. Rotondaro; R. T. Laaksonen; S. P. Singh

Plasma Parameters Obtained with Planar Probe and Optical Emission Spectroscopy
A. M. Daltrini; S. A. Moshkalev; L. Swart; P. B. Verdonck

Plasma Etching of Polycrystalline Silicon using Thinning Technology for Application in CMOS and MEMS Technologies
A. M. Nunes; S. A. Moshkalev; P. J. Tatsch; A. M. Daltrini

Effect of Nucleation Parameters of Ge Quantum Dots Grown over Silicon Oxide by LPCVD
S. N. M. Mestanza; I. Doi; N. C. Frateschi

Fabrication of Ti-Si-Ti Metal-Semiconductor-Metal Photodetectors Using Low Temperature Rapid Thermal Annealing
R. L. Ohta; C. E. Viana; N. I. Morimoto; B. H. V. Borges

Study of MOS Capacitors With TiO2 and SiO2/TiO2 Gate Dieletric
K. F. Albertin; M. A. Valle; I. Pereira

Bridging Electrical and Structural Interface Properties: a Combined DFT-GW Approach
L. R. C. Fonseca; PY. Prodhomme; P. Blaise

Charge-Based Continuous Equations for the Transconductance and Output Conductance of Graded-Channel SOI MOSFET's
M. de Souza; M. A. Pavanello

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