SBMicro 2021

35ᵗʰ Symposium on Microelectronics Technology

̶C̶a̶m̶p̶i̶n̶a̶s̶,̶ ̶S̶P̶,̶ ̶B̶r̶a̶z̶i̶l̶ ̶
August 23 to 27, 2021

Download the SBMicro 2021 Call For Papers

The SBMicro symposium is an international forum dedicated to fabrication and modeling of microsystems, integrated circuits and devices, held annually in Brazil. The goal of the symposium is to bring together researchers in the areas of processing, materials, characterization, modeling and TCAD of integrated circuits, microsensors, microactuators and MEMS. The SBMicro 2021 will be located in Campinas. This inter-national conference offers a unique blend of microelectronics and serves as a major conference for the discussion of interdisciplinary research around the world through a variety of formats, such as oral presentations, poster sessions, exhibits, panel discus-sions, and tutorial sessions. All approved papers will be published at the IEEEXplore. The best papers presented at the symposium will be invited to resubmit an extended version that will be considered for publication at the JICS – Journal of Integrated Circuits and Systems.

The areas of interest include:

• Nanoelectronics
• Device physics and characterization
• Modeling and simulation
• Semiconductor and MEMS
• Optoeletronics and photovoltaic
• Energy havesting
• Power devices
• Novel materials and devices
• Sensors and Actuators
• Plasma technology
• Display technology
• Reliability and yield
• Circuit-device interaction
• Biomedical devices
• Packaging
• Engineering education

Important Dates

Paper Submission Hard Deadline:
May 31st, 2021

Notification of Acceptance:
July 9ᵗʰ, 2021

Camera Ready Deadline:
July 23rd, 2021

Co-located Events:

34ᵗʰ SBCCI - Symposium on Integrated Circuits and Systems Design
11ᵗʰ WCAS - Workshop on Circuits and Systems Design
5ᵗʰ INSCIT - International Symposium on Instrumentation Systems, Circuits and Transducers
21st SForum - Microelectronics Students Forum

Paper Submission

SBMicro2021 will receive camera-ready submissions in English for consideration by the Program Committee with a maximum of 4 A4 pages, two-column following the IEEE conference format.

A complete template (Latex and Word) to prepare your paper is available Here.

The proceedings will be submitted for publication by IEEE and will remain available at IEEEXploreⓇ.

Click here to submit your paper.

For authors with accepted articles:

1) After reviewing the paper by following the reviewer(s) suggestions, authors should upload the corrected camera-ready paper once again via our online submission system (SOFT CONF).

2) After camera-ready submission deadline, authors will receive an e-mail with instructions to fill out and upload IEEE’s copyright form, as well as meet the latest IEEE XploreⓇ requirements for PDF files.

General Chair
Jacobus Swart, UNICAMP, Brazil

Panels Chairs
Roberto Panepucci, CTI, Brazil
Davies Monteiro, UFMG, Brazil

Publicity Chair
Linnyer Ruiz, UEM, Brazil
Ricardo Reis, UFRGS, Brazil

Liaison Americas / Asia / Europe
Fernando Guarin, Global Foundries, USA
Hiroshi Iwai, TIT, Japan
Cor Claeys, KU Leuven, Belgium

Program Chairs
Michelly de Souza, FEI, Brazil
Durga Misra, NJIT, USA

Local Chairs
Lucas Zucchi, UNICAMP, Brazil
Juliano Tavares, MannaTeam, Brazil
Aymara Villela, SBMicro, Brazil
Raphael Brum, UFRGS, Brazil
Lucas Mota, FEI, Brazil

Publication Chair
Giuseppe Cirino, UFSCar, Brazil

Tutorials Chair
Marcelo Pavanello, FEI, Brazil

Finance Chairs
Jose Alexandre Diniz, FEEC/UNICAMP, Brazil

Sponsored by:

Co-sponsored by:

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